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BRIGHT LED ELECTRONICS CORP.
SINCE 1981
BL-HJF34C-TRB
Features:
1. Emitted Color : Super Amber 2. Lens Appearance : Water Clear 3. Mono-color type. 4. 3.2x1.0x1.7mm(1204) standard package 5. Suitable for all SMT assembly methods. 6. Compatible with infrared and vapor phase reflow solder process. 7. Compatible with automatic placement equipment. 8. This product doesn't contain restriction Substance, comply ROHS standard.
Package Dimensions:
Applications:
1. Automotive : Dashboards, stop lamps, turn signals. 2. 3. Backlighting : LCDs, Key pads advertising. Status indicators : Comsumer & industrial electronics. NOTES: 1.All dimensions are in millimeters (inches). 2.Tolerance is 0.10mm (0.004") unless otherwise specified. 3.Specifications are subject to change without notice.
4. General use.
Absolute Maximum Ratings(Ta=25)
Parameter
Power Dissipation Forward Current Peak Forward Current 1 Reverse Volage Operating Temperature Storage Temperature Soldering Temperature
Symbol
Pd IF IFP VR Topr Tstg Tsol
Rating
100 30 100 5 -25~80 -30~85 See Page6
Unit
mW mA mA V -
1 Condition for IFp is pulse of 1/10 duty and 0.1msec width.
Ver.1.0 Page 1 of 7
BRIGHT LED ELECTRONICS CORP.
SINCE 1981
BL-HJF34C-TRB
Electrical and optical characteristics(Ta=25) Parameter
Forward Voltage Luminous Intensity Reverse Current Peak Wave Length Dominant Wave Length Spectral Line Half-width Veiwing Angle
Symbol
Vf Iv IR p d 21/2
Condition
IF=20mA IF=20mA VR=5V IF=20mA IF=20mA IF=20mA IF=20mA
Min.
42 600 -
Typ.
2.0 70 610 17 105
Max.
2.6 100 610 -
Unit
V mcd A nm nm nm deg
Typical Electro-Optical Characteristics Curves
Fig.2 Forward current derating curve Fig.1 Relative intensity vs. wavelength
1.0 60
vs. ambient temperature
50
Relative radiant intensity
Forward current (mA)
40
0.5
30
20
10
0
560
610
660
0
20
40
60
80
100
Wavelength (nm)
Ambient temperature Ta( C)
Fig.3 Forward current vs. forward voltage
50 3.0
Fig.4 Relative luminous intensity vs. ambient temperature
40 Relative Luminous intensity (Normalized @20mA)
2.5
Forward current (mA)
2.0
30
1.5
20
1.0
10
0.5
0
1
2
3
4
5
0 -40
-20
0
20
40
60
Forward voltage(V)
Ambient temperature Ta( C) A
Fig.6 Radiation diagram Fig.5 Relative luminous intensity vs. forward current
4.0 0 10 20 30
Relative luminous intensity (@20mA)
3.0
Relative radiant intensity
1.0
40
2.0
0.9 0.8
50 60 70
1.0
0.7
80 90
0
10
20
30
40
50
0.5
0.3
0.1
0.2
0.4
0.6
Forward current (mA)
Ver.1.0 Page 2 of 7
BRIGHT LED ELECTRONICS CORP.
SINCE 1981
BL-HJF34C-TRB
17.2 1.2
Tapping and packaging specifications(Units: mm)
USER DIRECTION OF FEED
1.22 0.1 1.88 0.1 ANODE
START END
13.0 0.5 TRAILER LEADER FIXING TAPE
71.0 1
5.3 0.05
CATHODE
4.0 0.1 4.0 0.1
1.5 0.1 2.0 0.05
1.75 0.1
3.5 0.05
8.0 0.3
3.43 0.1
0.3
NOTE: 3000 pcs PER REEL
Package Method:(unit:mm)
12 bag/box 3000 pcs/reel
200
Bar Code Label
245 220 187
220
Aluminum Foil Bag
645
6 box/carton
210 470
Ver.1.0 Page 3 of 7
179 1
BRIGHT LED ELECTRONICS CORP.
SINCE 1981
BL-HJF34C-TRB
Bin Limits I n t e n s i t y B i n L i m i ts ( A t 2 0 m A ) BIN CODE Min. (mcd)
N P Q R 37.0 55.0 82.0 120.0
Max. (mcd)
72.0 11 0 . 0 160.0 240.0
B IN x
Intensity BIN CODE
Ver.1.0 Page 4 of 7
BRIGHT LED ELECTRONICS CORP.
SINCE 1981
BL-HJF34C-TRB
Reliability Test
Classification Test Item Reference Standard Test Conditions Result
Operation Life MIL-STD-750:1026 MIL-STD-883:1005 JIS-C-7021 :B-1 High Temperature MIL-STD-202:103B High Humidity JIS-C-7021 :B-11 Endurance Storage Test High MIL-STD-883:1008 Temperature JIS-C-7021 :B-10 Storage Low :B-12 Temperature JIS-C-7021 Storage Temperature MIL-STD-202:107D Cycling MIL-STD-750:1051 MIL-STD-883:1010 JIS-C-7021 :A-4 Thermal Shock MIL-STD-202:107D Environmental MIL-STD-750:1051 Test MIL-STD-883:1011 Solder MIL-STD-202:201A Resistance MIL-STD-750:2031 JIS-C-7021 :A-1
Connect with a power If=20mA Ta=Under room temperature Test time=1,000hrs Ta=+655 RH=90%-95% Test time=240hrs High Ta=+855 Test time=1,000hrs Low Ta=-355 Test time=1,000hrs -35 ~ +25 ~ +85 ~ +25 60min 20min 60min 20min Test Time=5cycle -355 ~+855 20min 20min Test Time=10cycle Preheating 140-160,within 2 minutes. Operation heating 235(Max.), within 10seconds. (Max.)
0/20
0/20
0/20
0/20
0/20
0/20
0/20
Judgment criteria of failure for the reliability
Measuring items Forward voltage Reverse current Luminous intensity Symbol VF ( V) IR(uA) Iv ( mcd ) Measuring conditions IF=20mA VR=5V IF=20mA Judgement criteria for failure Over Ux1.2 Over Ux2 Below SX0.5
Note:
1.U means the upper limit of specified characteristics.
S means initial value.
2.Measurment shall be taken between 2 hours and after the test pieces have been returned to normal ambient conditions after completion of each test.
Ver.1.0 Page 5 of 7
BRIGHT LED ELECTRONICS CORP.
SINCE 1981
BL-HJF34C-TRB
Soldering :
1. Manual Of Soldering The temperature of the iron tip should not be higher than 300(572) and Soldering within 3 seconds per solder-land is to be observed. 2. Reflow Soldering Preheating : 140~1605,within 2 minutes. Operation heating : 235(Max.) within 10 seconds.(Max) Gradual Cooling (Avoid quenching).
10 SEC. MAX.
3. DIP soldering (Wave Soldering) : Preheating : 120~150,within 120~180 sec. Operation heating : 2455 within 5 sec.260 (Max) Gradual Cooling (Avoid quenching).
Handling :
Care must be taken not to cause to the epoxy resin portion of BRIGHT LEDs while it is exposed to high temperature. Care must be taken not rub the epoxy resin portion of BRIGHT LEDs with hard or sharp article such as the sand blast and the metal hook.
Temperature Temperature
140~160
235 MAX. 4 /SEC. MAX.
4 /SEC. MAX. OVER 2 MIN.
Time
Soldering heat Max. 260 120~150 245 5 within 5 sec.
Preheat 120~180 sec.
Time
Ver.1.0 Page 6 of 7

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